The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
Feb. 06, 2008
Ching Meng Fang, Singapore, SG;
Kin Yean Chow, Singapore, SG;
Larry M. Mandel, Noblesville, IN;
Sim Ying Yong, Singapore, SG;
Ching Meng Fang, Singapore, SG;
Kin Yean Chow, Singapore, SG;
Larry M. Mandel, Noblesville, IN;
Sim Ying Yong, Singapore, SG;
Delphi Technologies, Inc., Troy, MI (US);
Abstract
An improved overmolded electronic assembly includes a backplate, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, a metal ring on an outer side of a thermoplastic wall member of the electrical connector, and an overmold body. The metal ring circumscribes external connector pins of the electrical connector, and the overmold body together with the backplate and thermoplastic wall member of the electrical connector sealingly encase the circuit substrate and the circuit device defined on the substrate, with the overmold body having a peripheral edge in adhesive contact with the metal ring. The invention avoids delamination problems associate with similar arrangements which do not incorporate a metal ring.