Singapore, Singapore

Sim Ying Yong

USPTO Granted Patents = 5 

 

Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 59(Granted Patents)


Company Filing History:


Years Active: 2006-2016

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5 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Sim Ying Yong

Introduction

Sim Ying Yong is a notable inventor based in Singapore, SG. He has made significant contributions to the field of electronic assembly, holding a total of 5 patents. His work focuses on improving the functionality and reliability of electronic devices.

Latest Patents

One of his latest patents is for a ball grid array packaged camera device soldered to a substrate. This assembly attaches a ball grid array (BGA) packaged camera device to a printed circuit board (PCB) substrate. The design includes a spacer that prevents excessive collapse of solder balls during the reflow process. The spacer can be made from solder mask, tape, or legend ink.

Another significant patent is for a wrap-around overmold for electronic assembly. This improved overmolded electronic assembly features a backplate with a recessed edge and a circuit substrate mounted on it. The assembly includes at least one electronic component and conductive traces that define a circuit device. The overmold body wraps around the sides of the backplate, enhancing the assembly's durability and corrosion resistance.

Career Highlights

Sim Ying Yong is currently employed at Delphi Technologies, Inc., where he continues to innovate in the field of electronic assembly. His work has contributed to advancements in the reliability and performance of electronic devices.

Collaborations

He has collaborated with notable coworkers, including Larry M Mandel and Kin Yean Chow, further enhancing the innovative environment at Delphi Technologies.

Conclusion

Sim Ying Yong's contributions to electronic assembly through his patents demonstrate his commitment to innovation and improvement in technology. His work continues to influence the industry positively.

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