The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 2009
Filed:
Sep. 14, 2007
Thomas A. Degenkolb, Noblesville, IN (US);
Scott D. Brandenburg, Kokomo, IN (US);
Larry M. Mandel, Noblesville, IN (US);
Kin Yean Chow, Singapore, SG;
Ching Meng Fang, Singapore, SG;
Sim Ying Yong, Singapore, SG;
Thomas A. Degenkolb, Noblesville, IN (US);
Scott D. Brandenburg, Kokomo, IN (US);
Larry M. Mandel, Noblesville, IN (US);
Kin Yean Chow, Singapore, SG;
Ching Meng Fang, Singapore, SG;
Sim Ying Yong, Singapore, SG;
Delphi Technologies, Inc., Troy, MI (US);
Abstract
An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.