Kin Yean Chow

Title: Innovations by Kin Yean Chow

Introduction

Kin Yean Chow is a notable inventor based in Singapore, SG. He has made significant contributions to the field of electronic assembly, holding a total of 3 patents. His work focuses on improving the reliability and efficiency of electronic components through innovative designs.

Latest Patents

One of his latest patents is titled "Wrap-around overmold for electronic assembly." This invention features an improved overmolded electronic assembly that includes a backplate with a recessed edge, a circuit substrate, and at least one electronic component. The design incorporates conductive traces that define a circuit device, along with an electrical connector. The overmold body wraps around the sides of the backplate, addressing delamination issues during thermal cycling and enhancing corrosion resistance at connector-to-backplate interfaces. Another significant patent is the "Overmolded electronic assembly," which describes a partially overmolded component with a precisely defined overmolding edge. This design includes a component with a protruding elongate rib, allowing for better contact between the component and the overmolding tool.

Career Highlights

Kin Yean Chow has worked with prominent companies in the industry, including Delphi Technologies, Inc. and Delphi Technologies IP Limited. His experience in these organizations has contributed to his expertise in electronic assembly innovations.

Collaborations

Throughout his career, Kin Yean Chow has collaborated with various professionals, including Larry M. Mandel and Ching Meng Fang, who is a talented woman in the field.

Conclusion

Kin Yean Chow's innovative patents and contributions to electronic assembly demonstrate his commitment to advancing technology in this area. His work continues to influence the industry and improve the reliability of electronic components.