The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2006

Filed:

Dec. 16, 2004
Applicants:

Chih Kai Nah, Singapore, SG;

Morris D Stillabower, Tipton, IN (US);

Binghua Pan, Singapore, SG;

Sim Ying Yong, Singapore, SG;

Przemyslaw Gromala, Krakow, PL;

Inventors:

Chih Kai Nah, Singapore, SG;

Morris D Stillabower, Tipton, IN (US);

Binghua Pan, Singapore, SG;

Sim Ying Yong, Singapore, SG;

Przemyslaw Gromala, Krakow, PL;

Assignee:

Delphi Technologies, Inc., Troy, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 1/18 (2006.01); H05K 5/02 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic component arrangement includes a discrete electronic component having first and second terminals and a centre-exposed pad. A substrate has a first electrical conductor electrically connected to the first terminal, a second electrical conductor electrically connected to the second terminal, and a third electrical conductor. A thermally conductive element is in direct thermal communication with both the centre-exposed pad of the electronic component and the third electrical conductor of the substrate.


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