The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 2004
Filed:
Mar. 26, 2003
Larry M Mandel, Noblesville, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
An electronic assembly for conducting heat from a semiconductor device, such as a power flip chip, attached to a substrate. The substrate has a first region with conductors thereon, a second region surrounding and supporting the first region, and a third region surrounding and supporting the second region, with the second region being more flexible than the first and third regions. The chip is mounted to the first region of the substrate, and has solder connections on a first surface thereof that are registered with the conductors on the first region of the substrate. A heat-conductive member thermally contacts a second surface of the chip oppositely disposed from the first surface. A biasing element contacts the first region of the substrate to bias the chip into thermal contact with the heat-conductive member.