The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Oct. 19, 2006
Larry M Mandel, Nobelsville, IN (US);
Kevin M. Gertiser, Noblesville, IN (US);
Suresh K. Chengalva, Kokomo, IN (US);
Dwadasi H. Sarma, Kokomo, IN (US);
David W. Zimmerman, Fishers, IN (US);
Larry M Mandel, Nobelsville, IN (US);
Kevin M. Gertiser, Noblesville, IN (US);
Suresh K. Chengalva, Kokomo, IN (US);
Dwadasi H. Sarma, Kokomo, IN (US);
David W. Zimmerman, Fishers, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
An electronic package having enhanced heat dissipation is provided exhibiting dual conductive heat paths in opposing directions. The package includes a substrate having electrical conductors thereon and a flip chip mounted to the substrate. The flip chip has a first surface, solder bumps on the first surface, and a second surface oppositely disposed from the first surface. The flip chip is mounted to the substrate such that the solder bumps are registered with the conductors on the substrate. The package further includes a stamped metal heat sink in heat transfer relationship with the second surface of the flip chip. The heat sink includes a cavity formed adjacent to the flip chip containing a thermally conductive material.