The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2005
Filed:
Feb. 23, 2004
Applicants:
Scott D. Brandenburg, Kokomo, IN (US);
David A. Laudick, Kokomo, IN (US);
Thomas A. Degenkolb, Noblesville, IN (US);
Larry M Mandel, Noblesville, IN (US);
Richard D. Parker, Tipton, IN (US);
Inventors:
Scott D. Brandenburg, Kokomo, IN (US);
David A. Laudick, Kokomo, IN (US);
Thomas A. Degenkolb, Noblesville, IN (US);
Larry M Mandel, Noblesville, IN (US);
Richard D. Parker, Tipton, IN (US);
Assignee:
Delphi Technologies, Inc., Troy, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R012/00 ;
U.S. Cl.
CPC ...
Abstract
An electronic assembly and/or a mold is constructed to reduce deflection and resultant damage to components and/or an associated printed circuit board of the electronic assembly when the electronic assembly is overmolded.