Kokomo, IN, United States of America

David A Laudick

USPTO Granted Patents = 8 

 

Average Co-Inventor Count = 2.5

ph-index = 5

Forward Citations = 96(Granted Patents)


Company Filing History:


Years Active: 2005-2010

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8 patents (USPTO):Explore Patents

Title: Innovations by David A. Laudick

Introduction

David A. Laudick is a notable inventor based in Kokomo, Indiana, with a remarkable portfolio of eight patents. His work primarily focuses on advancements in electronic assembly technologies, showcasing his expertise in the field.

Latest Patents

Among his latest innovations is a method of producing an overmolded electronic module with a flexible circuit pigtail. This method involves fixturing the assembly in a mold cavity, allowing a portion of the flexible circuit to protrude from the mold. A compressible elastomeric interface is utilized to seal off the mold cavity, protecting the flexible circuit from damage due to the clamping force of the mold. Additionally, the flexible circuit is pre-coated with a material that ensures good adhesion with the molding compound. A heat exchanger is thermally coupled to the portion of the flexible circuit that protrudes from the mold, safeguarding it from thermal damage.

Another significant patent is the method of overmolding an electronic assembly that features an insert-molded vertical mount connector header. In this innovation, the electronic assembly is overmolded to create an encapsulated module. The conductor pins retained in the connector header are coupled to a circuit board, maintaining the connector header's position while leaving an open space between the header and the board. The assembly is then placed in a mold for plastic encapsulation, where the mold's floor accommodates the conductor pins and shroud of the connector header.

Career Highlights

David A. Laudick has made significant contributions to Delphi Technologies, Inc., where he applies his inventive skills to enhance electronic assembly processes. His patents reflect a deep understanding of the complexities involved in electronic manufacturing and assembly.

Collaborations

Throughout his career, David has collaborated with talented individuals such as Scott David Brandenburg and Larry M. Mandel. These partnerships have likely contributed to the innovative solutions he has developed.

Conclusion

David A. Laudick's contributions to the field of electronic assembly through his patents demonstrate his commitment to innovation and excellence. His work continues to influence the industry, paving the way for future advancements.

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