The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2007
Filed:
Jun. 27, 2005
Scott D. Brandenburg, Kokomo, IN (US);
David A. Laudick, Kokomo, IN (US);
Thomas A. Degenkolb, Noblesville, IN (US);
Matthew R. Walsh, Sharpsville, IN (US);
Jeenhuei S. Tsai, Carmel, IN (US);
Scott D. Brandenburg, Kokomo, IN (US);
David A. Laudick, Kokomo, IN (US);
Thomas A. Degenkolb, Noblesville, IN (US);
Matthew R. Walsh, Sharpsville, IN (US);
Jeenhuei S. Tsai, Carmel, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending from an inner surface. A cavity of the first and second mold portions provides a mold cavity, when joined. A backplate is also provided that includes a plurality of support pedestals and an integrated heatsink extending from a first side of the backplate. A substrate includes a first side of an integrated circuit (IC) die mounted to a first side of the substrate. The backplate and the substrate are placed within the cavity of the second mold portion and the support pedestals are in contact with the first side of the substrate. The first and second mold portions are joined and the mold pins contact a second surface of the substrate during an overmolding process.