KyungOe Kim

This inventor holds 26 USPTO granted patents and 4 published patent applications, primarily in Integrated Circuit Packaging. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2010-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: KyungOe Kim. Retrieved from https://idiyas.com/inventor/kyungoe-kim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 (Patent Applications = 4)

% Patents Active = 100.0

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 64(Granted Patents)

Location History:

Kyoung-gi-Do, KR (2010)
Icheon, KR (2012)
Kyoungki-do, KR (2012)
Daegeon, KR (2010 - 2017)
Daejeon, KR (2014 - 2018)
Incheon, KR (2023 - 2024)

Company Filing History:

26 out of 1,845

Stats Chippac Pte. Ltd.

patents

Years Active: 2010-2025

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Areas of Expertise:

Integrated Circuit Packaging

Photonic Semiconductor

Thermally Enhanced FCBGA

Die-Beam Alignment

Laser-Assisted Bonding

Solder Joint Interconnection

EMI Shield

Warpage Control

Flip Chip Interconnection

Heat Spreader

Plasma Processing

Substrate Manufacturing

26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12218114 - Semiconductor device and method of making a photonic semiconductor package (2025-02-04),

2. 12107028 - Thermally enhanced FCBGA package (2024-10-01),

3. 12074135 - Semiconductor device and method of controlling warpage during LAB (2024-08-27),

4. 11929334 - Die-beam alignment for laser-assisted bonding (2024-03-12),

5. 11823973 - Package with compartmentalized lid for heat spreader and EMI shield (2023-11-21),

6. 11817357 - Region-of-interest positioning for laser-assisted bonding (2023-11-14),

7. 11688718 - Semiconductor device and method of controlling warpage during LAB (2023-06-27),

8. 11670563 - Thermally enhanced FCBGA package (2023-06-06),

9. 10109587 - Integrated circuit packaging system with substrate and method of manufacture thereof (2018-10-23),

10. 9773685 - Solder joint flip chip interconnection having relief structure (2017-09-26),

11. 9412624 - Integrated circuit packaging system with substrate and method of manufacture thereof (2016-08-09),

12. 9373573 - Solder joint flip chip interconnection (2016-06-21),

13. 9093278 - Method of manufacture of integrated circuit packaging system with plasma processing (2015-07-28),

14. 8859342 - Integrated circuit packaging system with substrate mold gate and method of manufacture thereof (2014-10-14),

15. 8810029 - Solder joint flip chip interconnection (2014-08-19),

Title: KyungOe Kim: Pioneering Inventor from Daegeon, KR

Introduction: KyungOe Kim is a distinguished inventor hailing from Daegeon, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: KyungOe Kim holds several patents in the realm of electronics and telecommunications, showcasing his expertise and creativity in developing cutting-edge solutions for modern challenges.

Career Highlights: Throughout his illustrious career, KyungOe Kim has worked with various tech companies, leading research teams and spearheading projects that have resulted in significant advancements in the industry.

Collaborations: KyungOe Kim has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge-sharing to push the boundaries of what is possible.

Conclusion: KyungOe Kim's passion for innovation, coupled with his relentless drive to create solutions that make a difference, solidifies his position as a trailblazer in the world of inventions and patents.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

4 patents pending: