The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Oct. 12, 2020
Applicant:
Stats Chippac Pte. Ltd., Singapore, SG;
Inventors:
Assignee:
STATS ChipPAC Pte. Ltd., Singapore, SG;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/03 (2006.01); B23K 1/005 (2006.01); B23K 26/06 (2014.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); B23K 1/0056 (2013.01); H01L 24/03 (2013.01); H05K 3/34 (2013.01); H01L 2224/0363 (2013.01); H05K 2203/107 (2013.01);
Abstract
A method of making a semiconductor device involves the steps of disposing a first semiconductor die over a substrate and disposing a beam homogenizer over the first semiconductor die. A beam from the beam homogenizer impacts the first semiconductor die. The method further includes the steps of determining a positional offset of the beam relative to the first semiconductor die in a number of pixels, using a first calibration equation to convert the number of pixels into a distance in millimeters, and moving the beam homogenizer the distance in millimeters to align the beam and first semiconductor die.