The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
Dec. 20, 2013
Joonyoung Choi, Guwangju-si, KR;
Seong Won Park, Icheon-si, KR;
Kyungoe Kim, Daejeon, KR;
Hun Teak Lee, Seongnam-si, KR;
Sungwon Cho, Icheon-si, KR;
JoonYoung Choi, Guwangju-si, KR;
Seong Won Park, Icheon-si, KR;
KyungOe Kim, Daejeon, KR;
Hun Teak Lee, Seongnam-si, KR;
SungWon Cho, Icheon-si, KR;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system including: heating a support structure having a conductive pad and an organic surface protection layer on the conductive pad; removing the organic surface protection layer from the conductive pad by a plasma process with a two-step method, the two-step method includes a first step with a dioxygen and a second step with a dihydrogen, wherein the second step immediately follows the first step; and forming an underfill over the conductive pad.