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For the Inventor, By the Inventor

Suwon, South Korea

Kyung Seob Oh

This inventor holds 19 USPTO granted patents and 7 published patent applications. Top assignees: Samsung Electro-Mechanics Co., Ltd., Samsung Electronics Co., Ltd., Samsung Led Co., Ltd.. Active years: 2009-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kyung Seob Oh. Retrieved from https://idiyas.com/inventor/kyung-seob-oh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 89.5

Average Co-Inventor Count = 4.0

ph-index = 4

Forward Citations = 70(Granted Patents)


Location History:

  • Incheon-si, KR (2011)
  • Incheon, KR (2009 - 2013)
  • Gyunggi-do, KR (2013)
  • Suwon, KR (2015)
  • Suwon-si, KR (2017 - 2021)

Company Filing History:

goldMedal11 out of 7,633 
 
Samsung Electro-Mechanics Co., Ltd.
 patents
silverMedal6 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents
bronzeMedal2 out of 207 
 
Samsung Led Co., Ltd.
 patents

Years Active: 2009-2021

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19 patents (USPTO):Explore Patents
1. 11011482 - Fan-out semiconductor package (2021-05-18),
2. 10714437 - Fan-out semiconductor package (2020-07-14),
3. 10622322 - Fan-out semiconductor package and method of manufacturing the fan-out semiconductor (2020-04-14),
4. 10600748 - Fan-out semiconductor package (2020-03-24),
5. 10566289 - Fan-out semiconductor package and manufacturing method thereof (2020-02-18),
6. 10224288 - Fan-out semiconductor package (2019-03-05),
7. 10211149 - Fan-out semiconductor package (2019-02-19),
8. 10170382 - Fan-out semiconductor package (2019-01-01),
9. 9929100 - Electronic component package and method of manufacturing the same (2018-03-27),
10. 9905526 - Electronic component package and method of manufacturing the same (2018-02-27),
11. 9881873 - Fan-out semiconductor package (2018-01-30),
12. 9825003 - Electronic component package and method of manufacturing the same (2017-11-21),
13. 8957319 - Method for removing seed layer in manufacturing printed circuit board and printed circuit board manufactured by using the same (2015-02-17),
14. 8582314 - Interconnection structure, interposer, semiconductor package, and method of manufacturing interconnection structure (2013-11-12),
15. 8434918 - Lighting apparatus using light emitting device package (2013-05-07),

Title: Kyung Seob Oh: Pioneering Inventor from Suwon-si, KR

Introduction: Kyung Seob Oh is a distinguished inventor hailing from Suwon-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kyung Seob Oh holds several patents in the realm of electronics and telecommunications, showcasing his expertise and innovative mindset in developing cutting-edge solutions.

Career Highlights: With a career spanning over two decades, Kyung Seob Oh has worked with various tech companies, leading research teams, and spearheading projects that have revolutionized the industry.

Collaborations: Throughout his career, Kyung Seob Oh has collaborated with top researchers, engineers, and scientists globally, fostering a culture of innovation and knowledge exchange.

Conclusion: Kyung Seob Oh's relentless pursuit of innovation and his passion for pushing the boundaries of technology make him a true trailblazer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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