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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9929100 B1

PDFFull Text
Date of Patent:
Mar. 27, 2018

Filed:

Mar. 21, 2016

Electronic component package and method of manufacturing the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Doo Hwan Lee, Suwon-si, KR;

Hyoung Joon Kim, Suwon-si, KR;

Jong Rip Kim, Suwon-si, KR;

Kyung Seob Oh, Suwon-si, KR;

Ung Hui Shin, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Gyeonggi-Do, Suwon-si, KR;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Erik Kielin

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/544 (2006.01); H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/10 (2006.01); H01L 25/10 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 23/13 (2013.01); H01L 23/49827 (2013.01); H01L 23/5384 (2013.01); H01L 23/544 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/5386 (2013.01); H01L 25/105 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/24227 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01);
Abstract

An electronic component package and a method of manufacturing an electronic component package are provided. An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity, a redistribution layer disposed adjacent to the frame and electrically connected to the electronic component, and an encapsulation material encapsulating the electronic component and having an elastic modulus smaller than that of a material constituting the frame.

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