The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
Jun. 24, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Kyoung Moo Harr, Suwon-si, KR;
Ji Hoon Kim, Suwon-si, KR;
Kyung Seob Oh, Suwon-si, KR;
Sun Ho Kim, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3512 (2013.01);
Abstract
An electronic component package includes a redistribution layer, an electronic component disposed on the redistribution layer, and an encapsulant encapsulating the electronic component. The electronic component has a trench formed in one side thereof.