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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9825003 B1

PDFFull Text
Date of Patent:
Nov. 21, 2017

Filed:

Jun. 14, 2016

Electronic component package and method of manufacturing the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Kyung Seob Oh, Suwon-si, KR;

Young Min Kim, Suwon-si, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Walter H Swanson

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/6835 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/481 (2013.01); H01L 23/544 (2013.01); H01L 24/14 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68372 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0237 (2013.01); H01L 2224/05111 (2013.01); H01L 2224/05116 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13016 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/10252 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/14 (2013.01); H01L 2924/186 (2013.01);
Abstract

An electronic component package includes a first insulating layer having a via formed therein and a pattern formed thereon, an electronic component disposed on the first insulating layer so that an inactive side thereof is directed toward the first insulating layer, and a second insulating layer disposed on the first insulating layer so as to cover the electronic component and having a redistribution pattern formed thereon so as to be electrically connected to the electronic component.

Find Patent Forward Citations

Oh, Kyung. (2017). Electronic component package and method of manufacturing the same (U.S. Patent No. 9825003). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9825003

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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