Kurt Hingerl

Title: Kurt Hingerl: Innovator in Substrate Bonding Technologies

Introduction

Kurt Hingerl is a notable inventor based in Wolfern, Austria, recognized for his contributions to substrate bonding technologies. With a total of nine patents to his name, Hingerl has made significant advancements in methods and devices that enhance the efficiency and effectiveness of bonding processes in various applications.

Latest Patents

Hingerl's latest patents include a method and device for bonding substrates. This innovative method involves the production of an amorphous layer on one or both substrates, followed by bonding them together at these layers. The process is completed by irradiating the amorphous layers to transform them into crystalline layers, thereby creating a robust substrate stack. Another significant patent is a method for producing a connection between component parts. This method details the use of partially exposed insulating layers and through-vias to create mechanical and electrical connections between components through a direct bonding process.

Career Highlights

Throughout his career, Kurt Hingerl has worked with prominent companies in the semiconductor and optoelectronics industries. Notable among these are EV Group and Osram Opto Semiconductors. His work in these organizations has allowed him to refine his expertise in substrate bonding technologies and contribute to cutting-edge innovations.

Collaborations

Hingerl has collaborated with esteemed colleagues such as Markus Wimplinger and Thomas Plach. These partnerships have fostered a collaborative environment that has led to the development of advanced bonding techniques and technologies.

Conclusion

Kurt Hingerl's innovative work in substrate bonding has positioned him as a key figure in the field of materials science. His patents reflect a commitment to advancing technology and improving manufacturing processes. His contributions continue to influence the industry and inspire future innovations.