The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Aug. 30, 2011
Klaus Martinschitz, St. Florian am Inn, AT;
Markus Wimplinger, Ried im Innkreis, AT;
Bernhard Rebhan, Haag a. H., AT;
Kurt Hingerl, Wolfern, AT;
Klaus Martinschitz, St. Florian am Inn, AT;
Markus Wimplinger, Ried im Innkreis, AT;
Bernhard Rebhan, Haag a. H., AT;
Kurt Hingerl, Wolfern, AT;
EV Group E. Thallner GmbH, St. Florian am Inn, AT;
Abstract
A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused.