Klaus Martinschitz

Title: Klaus Martinschitz: Innovator in Wafer Bonding Technology

Introduction

Klaus Martinschitz is a notable inventor based in St. Florian am Inn, Austria. He has made significant contributions to the field of wafer bonding technology, holding 2 patents that showcase his innovative methods.

Latest Patents

Martinschitz's latest patents include a method for permanently bonding wafers by a connecting layer through solid state diffusion or phase transformation. This method involves bonding a first solid substrate to a second solid substrate, which contains a first material. The process includes the formation of a function layer on the second solid substrate, followed by pressing the two substrates together to create a permanent bond, reinforced by solid diffusion and/or phase transformation. His second patent details a method and device for permanent bonding of wafers, which includes working the bond surfaces with a cutting tool at specific speeds and temperatures to achieve a surface roughness of less than 1 µm. This method ensures a strong permanent bond primarily produced by recrystallization at the bond surfaces.

Career Highlights

Klaus Martinschitz is associated with Ev Group E. Thallner GmbH, where he continues to develop and refine his innovative techniques in wafer bonding. His work has positioned him as a key figure in advancing this technology.

Collaborations

Martinschitz collaborates with notable colleagues such as Markus Wimplinger and Bernhard Rebhan, contributing to a dynamic team focused on innovation in the semiconductor industry.

Conclusion

Klaus Martinschitz's contributions to wafer bonding technology through his patents and collaborative efforts highlight his role as a significant inventor in the field. His innovative methods continue to influence advancements in semiconductor manufacturing.