Ev Group E. Thallner Gmbh

Klaus Martinschitz

Markus Wimplinger

Bernhard Rebhan

Kurt Hingerl

A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused.

Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation

A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material. The method including the steps of: working one of the first and/or second bond surfaces with a cutting tool at a speed vthat is below a critical speed vand at a temperature Tthat exceeds a critical temperature T, down to a surface roughness O that is less than 1 &#x3bc;m; bringing the first solid substrate into contact with the second solid substrate at the bond surfaces, and exposing the solid substrates that are in contact to temperature in order to form a permanent bond that is at least primarily produced by recrystallization at the bond surfaces.

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St. Florian am Inn, Austria

Klaus Martinschitz