For the Inventor, By the Inventor

Enter assignee name

St. Florian, Austria

Ev Group E. Thallner Gmbh

Calculating rank

USPTO Granted Patents = 188

EPO Patents = 127

Trademarks = 2

Forward Citations = 381

Loading Chart...

Loading Chart...

77 inventors (with patents filed for the assignee):

Markus Wimplinger (61 out of 70 patents)

Thomas Wagenleitner (45 out of 47 patents)

Thomas Plach (31 out of 31 patents)

4. Friedrich Paul Lindner (25 out of 39 patents)

5. Florian Kurz (18 out of 18 patents)

6. Jurgen Markus Suss (17 out of 17 patents)

7. Gerald Kreindl (13 out of 13 patents)

8. Boris Povazay (12 out of 12 patents)

9. Viorel Dragoi (11 out of 11 patents)

10. Jurgen Burggraf (11 out of 17 patents)

11. Dominik Zinner (10 out of 10 patents)

12. Thomas Glinsner (10 out of 11 patents)

13. Andreas Fehkuhrer (9 out of 9 patents)

14. Jurgen Mallinger (8 out of 8 patents)

15. Kurt Hingerl (8 out of 9 patents)

Core Competencies:

Substrate Bonding

Microstructure Production

Surface Treatment

Alignment Techniques

Protective Coating

Stamp Embossing

Wafers Retention

Heat Application

Photosensitive Coatings

Chip Bonding

Deformable Heater

Measurement Devices

188 patents: Sort by Forward Citations

1. 12787693 - Device and method for adjusting a detection means (2026-11-03),

2. 12745600 - Method and device for the alignment of a substrate (2026-09-22),

3. 12722908 - Method and device for transferring components (2026-09-01),

4. 12635477 - Substrate holder with central elevation and support elevations and method for producing a substrate holder for bonding thereof (2026-05-19),

5. 12622221 - Method for the separation of structures from a substrate (2026-05-05),

6. 12600062 - Method and device for detaching a stamp (2026-04-14),

7. 12581908 - Substrate holder and method for fixing and bonding a substrate (2026-03-17),

8. 12577678 - Method for applying a protective coating material (2026-03-17),

9. 12550679 - Substrate holder device and method for bonding (2026-02-10),

10. 12510834 - Method and device for the alignment of substrates (2025-12-30),

11. 12482678 - Apparatus with deformable heater and method for heating a substrate thereof (2025-11-25),

12. 12481222 - Method and device for the exposure of a photosensitive coating (2025-11-25),

13. 12467850 - Device and method for measuring a substrate (2025-11-11),

14. 12456720 - Method for bonding of chips (2025-10-28),

15. 12412865 - Apparatus and method for bonding substrates (2025-09-09),

Company Overview

Ev Group E. Thallner Gmbh, based in St. Florian, Austria, specializes in advanced substrate bonding technologies essential for microelectronics and semiconductor manufacturing. The company focuses on innovative solutions in microstructure production, surface treatment, and alignment techniques, enabling high-precision applications. Their expertise extends to protective coatings, stamp embossing, and wafer retention, coupled with heat application methods, positioning them as a key player in the development of cutting-edge manufacturing processes for various industries.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Nov 10 2026

188 Patents

#1 in St. Florian

#17 in Austria

#4,477 in the World

St. Florian, Austria

Ev Group E. Thallner Gmbh

Forward Citations = 381

77 inventors:

Markus Wimplinger (61 out of 70 patents)

Thomas Wagenleitner (45 out of 47 patents)

Thomas Plach (31 out of 31 patents)

4. Friedrich Paul Lindner (25 out of 39 patents)

5. Florian Kurz (18 out of 18 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Ev Group E. Thallner Gmbh. Retrieved from https://idiyas.com/company/ev-group-e-thallner

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…