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St. Florian am Inn, Austria

Ev Group E. Thallner Gmbh

USPTO Granted Patents = 178

CIPO Patents = 6

EPO Patents = 131

Trademarks = 13

Forward Citations = 323

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105 inventors (with patents filed for the assignee):

Markus Wimplinger (61 out of 70 patents)

Thomas Wagenleitner (43 out of 45 patents)

Thomas Plach (29 out of 29 patents)

4. Friedrich Paul Lindner (25 out of 39 patents)

5. Florian Kurz (18 out of 18 patents)

6. Jurgen Markus Suss (16 out of 16 patents)

7. Gerald Kreindl (13 out of 13 patents)

8. Viorel Dragoi (11 out of 11 patents)

9. Boris Povazay (11 out of 11 patents)

10. Jurgen Burggraf (10 out of 16 patents)

11. Thomas Glinsner (10 out of 11 patents)

12. Andreas Fehkuhrer (9 out of 9 patents)

13. Dominik Zinner (8 out of 8 patents)

14. Kurt Hingerl (8 out of 9 patents)

15. Jurgen Mallinger (7 out of 7 patents)

Core Competencies:

Deformable Heater

Photosensitive Coating

Substrate Measurement

Chip Bonding

Microstructures Production

Substrate Alignment

Surface Treatment

Component Transfer

Embossing Techniques

Wafers Retention

Optical Subsystems Alignment

Electrostatic Holder

178 patents: Sort by Forward Citations

1. 12482678 - Apparatus with deformable heater and method for heating a substrate thereof (2025-11-25),

2. 12481222 - Method and device for the exposure of a photosensitive coating (2025-11-25),

3. 12467850 - Device and method for measuring a substrate (2025-11-11),

4. 12456720 - Method for bonding of chips (2025-10-28),

5. 12412865 - Apparatus and method for bonding substrates (2025-09-09),

6. 12292682 - Method and device for producing micro- and/or nanostructures (2025-05-06),

7. 12283491 - Method for producing singulated encapsulated components (2025-04-21),

8. 12199062 - Device and method for the alignment of substrates (2025-01-14),

9. 12135500 - Stamp and method for embossing (2024-11-05),

10. 12131907 - Device and method for bonding of substrates (2024-10-29),

11. 12107057 - Method for permanent connection of two metal surfaces (2024-10-01),

12. 12106993 - Method and device for aligning substrates (2024-10-01),

13. 12103787 - Method and device for transferring components (2024-10-01),

14. 12087726 - Device and method for joining substrates (2024-09-10),

15. 12062521 - Method for prefixing of substrates (2024-08-13),

EV Group (EVG) is a leading supplier of equipment and process solutions for wafer manufacturing and advanced packaging. The company provides innovative technologies and leading-edge solutions for the semiconductor, MEMS (micro-electro-mechanical systems), nanotechnology, and other high-tech industries. With more than 40 years of experience, EV Group is recognized for its expertise in wafer bonding, lithography/nanoimprint lithography (NIL), and metrology. The company's comprehensive product portfolio includes wafer bonders, lithography/nanoimprint lithography systems, metrology solutions, temporary bonding/debonding (TB/DB) equipment, and process control software. EV Group has a global presence, serving customers through its subsidiaries and sales offices worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

178 Patents

#1 in St. Florian am Inn

#20 in Austria

#4,544 in the World

St. Florian am Inn, Austria

Ev Group E. Thallner Gmbh

Forward Citations = 323

105 inventors:

Markus Wimplinger (61 out of 70 patents)

Thomas Wagenleitner (43 out of 45 patents)

Thomas Plach (29 out of 29 patents)

4. Friedrich Paul Lindner (25 out of 39 patents)

5. Florian Kurz (18 out of 18 patents)

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