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For the Inventor, By the Inventor

St. Florian, Austria

Ev Group E. Thallner Gmbh


USPTO Granted Patents = 187


Trademarks = 2

Forward Citations = 369

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77 inventors (with patents filed for the assignee):

goldMedal Markus Wimplinger (61 out of 70 patents)

silverMedal Thomas Wagenleitner (45 out of 47 patents)

bronzeMedal Thomas Plach (31 out of 31 patents)

4.  Friedrich Paul Lindner (25 out of 39 patents)

5.  Florian Kurz (18 out of 18 patents)

6.  Jurgen Markus Suss (17 out of 17 patents)

7.  Gerald Kreindl (13 out of 13 patents)

8.  Boris Povazay (12 out of 12 patents)

9.  Viorel Dragoi (11 out of 11 patents)

10.  Jurgen Burggraf (11 out of 17 patents)

11.  Thomas Glinsner (10 out of 11 patents)

12.  Dominik Zinner (9 out of 9 patents)

13.  Andreas Fehkuhrer (9 out of 9 patents)

14.  Jurgen Mallinger (8 out of 8 patents)

15.  Kurt Hingerl (8 out of 9 patents)


Core Competencies:
Substrate Bonding
Microstructure Production
Surface Treatment
Alignment Techniques
Protective Coating
Stamp Embossing
Wafers Retention
Heat Application
Photosensitive Coatings
Chip Bonding
Deformable Heater
Measurement Devices

187 patents:

1. 12745600 - Method and device for the alignment of a substrate (2026-09-22),
2. 12722908 - Method and device for transferring components (2026-09-01),
3. 12635477 - Substrate holder with central elevation and support elevations and method for producing a substrate holder for bonding thereof (2026-05-19),
4. 12622221 - Method for the separation of structures from a substrate (2026-05-05),
5. 12600062 - Method and device for detaching a stamp (2026-04-14),
6. 12581908 - Substrate holder and method for fixing and bonding a substrate (2026-03-17),
7. 12577678 - Method for applying a protective coating material (2026-03-17),
8. 12550679 - Substrate holder device and method for bonding (2026-02-10),
9. 12510834 - Method and device for the alignment of substrates (2025-12-30),
10. 12482678 - Apparatus with deformable heater and method for heating a substrate thereof (2025-11-25),
11. 12481222 - Method and device for the exposure of a photosensitive coating (2025-11-25),
12. 12467850 - Device and method for measuring a substrate (2025-11-11),
13. 12456720 - Method for bonding of chips (2025-10-28),
14. 12412865 - Apparatus and method for bonding substrates (2025-09-09),
15. 12292682 - Method and device for producing micro- and/or nanostructures (2025-05-06),
Ev Group E. Thallner Gmbh, based in St. Florian, Austria, specializes in advanced substrate bonding technologies essential for microelectronics and semiconductor manufacturing. The company focuses on innovative solutions in microstructure production, surface treatment, and alignment techniques, enabling high-precision applications. Their expertise extends to protective coatings, stamp embossing, and wafer retention, coupled with heat application methods, positioning them as a key player in the development of cutting-edge manufacturing processes for various industries.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

Ev Group E. Thallner Gmbh
187 Patents

#1 in St. Florian

#17 in Austria

#4,495 in the World

St. Florian, AT
St. Florian, Austria

Ev Group E. Thallner Gmbh

Forward Citations = 369

77 inventors:

goldMedal Markus Wimplinger (61 out of 70 patents)

silverMedal Thomas Wagenleitner (45 out of 47 patents)

bronzeMedal Thomas Plach (31 out of 31 patents)

4.  Friedrich Paul Lindner (25 out of 39 patents)

5.  Florian Kurz (18 out of 18 patents)

Please report any incorrect information to [email protected]
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