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For the Inventor, By the Inventor

St. Florian am Inn, Austria

Ev Group E. Thallner Gmbh


USPTO Granted Patents = 179


Trademarks = 13

Forward Citations = 325

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73 inventors (with patents filed for the assignee):

goldMedal Markus Wimplinger (61 out of 70 patents)

silverMedal Thomas Wagenleitner (44 out of 46 patents)

bronzeMedal Thomas Plach (29 out of 29 patents)

4.  Friedrich Paul Lindner (25 out of 39 patents)

5.  Florian Kurz (18 out of 18 patents)

6.  Jurgen Markus Suss (16 out of 16 patents)

7.  Gerald Kreindl (13 out of 13 patents)

8.  Viorel Dragoi (11 out of 11 patents)

9.  Boris Povazay (11 out of 11 patents)

10.  Jurgen Burggraf (10 out of 16 patents)

11.  Thomas Glinsner (10 out of 11 patents)

12.  Andreas Fehkuhrer (9 out of 9 patents)

13.  Dominik Zinner (8 out of 8 patents)

14.  Kurt Hingerl (8 out of 9 patents)

15.  Jurgen Mallinger (7 out of 7 patents)


Core Competencies:
Deformable Heater
Photosensitive Coating
Substrate Measurement
Chip Bonding
Microstructures Production
Substrate Alignment
Surface Treatment
Component Transfer
Embossing Techniques
Wafers Retention
Optical Subsystems Alignment
Electrostatic Holder

179 patents:

1. 12510834 - Method and device for the alignment of substrates (2025-12-30),
2. 12482678 - Apparatus with deformable heater and method for heating a substrate thereof (2025-11-25),
3. 12481222 - Method and device for the exposure of a photosensitive coating (2025-11-25),
4. 12467850 - Device and method for measuring a substrate (2025-11-11),
5. 12456720 - Method for bonding of chips (2025-10-28),
6. 12412865 - Apparatus and method for bonding substrates (2025-09-09),
7. 12292682 - Method and device for producing micro- and/or nanostructures (2025-05-06),
8. 12283491 - Method for producing singulated encapsulated components (2025-04-21),
9. 12199062 - Device and method for the alignment of substrates (2025-01-14),
10. 12135500 - Stamp and method for embossing (2024-11-05),
11. 12131907 - Device and method for bonding of substrates (2024-10-29),
12. 12107057 - Method for permanent connection of two metal surfaces (2024-10-01),
13. 12106993 - Method and device for aligning substrates (2024-10-01),
14. 12103787 - Method and device for transferring components (2024-10-01),
15. 12087726 - Device and method for joining substrates (2024-09-10),
EV Group (EVG) is a leading supplier of equipment and process solutions for wafer manufacturing and advanced packaging. The company provides innovative technologies and leading-edge solutions for the semiconductor, MEMS (micro-electro-mechanical systems), nanotechnology, and other high-tech industries. With more than 40 years of experience, EV Group is recognized for its expertise in wafer bonding, lithography/nanoimprint lithography (NIL), and metrology. The company's comprehensive product portfolio includes wafer bonders, lithography/nanoimprint lithography systems, metrology solutions, temporary bonding/debonding (TB/DB) equipment, and process control software. EV Group has a global presence, serving customers through its subsidiaries and sales offices worldwide.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 30 2025

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179 Patents

#1 in St. Florian am Inn

#20 in Austria

#4,530 in the World

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St. Florian am Inn, Austria

Ev Group E. Thallner Gmbh

Forward Citations = 325

73 inventors:

goldMedal Markus Wimplinger (61 out of 70 patents)

silverMedal Thomas Wagenleitner (44 out of 46 patents)

bronzeMedal Thomas Plach (29 out of 29 patents)

4.  Friedrich Paul Lindner (25 out of 39 patents)

5.  Florian Kurz (18 out of 18 patents)

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