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For the Inventor, By the Inventor

Senftenbach, Austria

Andreas Fehkuhrer

This inventor holds 9 USPTO granted patents and 3 published patent applications. Top assignee: Ev Group E. Thallner Gmbh. Active years: 2017-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andreas Fehkuhrer. Retrieved from https://idiyas.com/inventor/andreas-fehkuhrer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 9 

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:

goldMedal9 out of 188 
 
Ev Group E. Thallner Gmbh
 patents

Years Active: 2017-2023

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9 patents (USPTO):Explore Patents
1. 11742205 - Method and device for bonding of substrates (2023-08-29),
2. 11101132 - Method and device for bonding of substrates (2021-08-24),
3. 10755930 - Method and device for bonding of substrates (2020-08-25),
4. 10755929 - Method and device for bonding of substrates (2020-08-25),
5. 10475672 - Device and method for at least partly dissolving a connecting layer of a temporarily bonded substrate stack (2019-11-12),
6. 10049902 - Substrate stack holder, container and method for parting a substrate stack (2018-08-14),
7. 9922862 - Device and method for loosening a first substrate (2018-03-20),
8. 9859246 - Method for bonding substrates (2018-01-02),
9. 9786487 - Method for coating cavities of semiconductor substrates (2017-10-10),

Title: Innovations by Andreas Fehkuhrer

Introduction

Andreas Fehkuhrer is a notable inventor based in Senftenbach, Austria. He has made significant contributions to the field of substrate bonding, holding a total of nine patents. His work focuses on innovative methods and devices that enhance the efficiency and effectiveness of bonding processes.

Latest Patents

One of his latest patents is a method and device for bonding substrates within a sealed bonding chamber. This innovative approach includes several steps: fixing the first and second substrates, arranging them, mutually approaching them, and contacting them at specific bond initiation points. The process generates a bonding wave that travels from these points to the edges of the substrates. Furthermore, the bonding wave can be influenced during its course by regulating the pressure inside the bonding chamber, allowing for targeted adjustments to improve bonding quality.

Career Highlights

Andreas Fehkuhrer is currently employed at EV Group E. Thallner GmbH, where he continues to develop cutting-edge technologies in substrate bonding. His expertise and innovative mindset have positioned him as a key player in his field.

Collaborations

He collaborates closely with his coworker, Thomas Wagenleitner, to advance their research and development efforts.

Conclusion

Andreas Fehkuhrer's contributions to substrate bonding technology exemplify his commitment to innovation and excellence in his field. His patents reflect a deep understanding of the complexities involved in bonding processes, making him a valuable asset to the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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