The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2017
Filed:
Jan. 09, 2015
Applicant:
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Inventor:
Andreas Fehkuhrer, Senftenbach, AT;
Assignee:
EV GROUP E. THALLNER GMBH, St. Florian am Inn, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/44 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); B08B 3/08 (2006.01); B08B 3/12 (2006.01); B08B 5/00 (2006.01); B08B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02057 (2013.01); B08B 3/08 (2013.01); B08B 3/12 (2013.01); B08B 5/00 (2013.01); B08B 7/0014 (2013.01); B08B 7/0035 (2013.01); H01L 21/76898 (2013.01);
Abstract
A method for temporary coating of cavities, which at least partially run through a semiconductor substrate and are provided for a permanent coating and/or equipping, with a temporarily applied coating material before processing steps for processing at least one surface of the semiconductor substrate. In addition, a method for removing a temporary coating of cavities of a semiconductor substrate, whereby the coating is applied according to a previously-mentioned method and whereby, in particular immediately afterwards, a permanent coating and/or equipping of the cavities is carried out.