The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2025
Filed:
Feb. 15, 2022
Applicant:
Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;
Inventors:
Dominik Zinner, Zell an der Pram, AT;
Thomas Wagenleitner, Aurolzmunster, AT;
Jurgen Markus Suss, Scharding, AT;
Thomas Plach, St. Florian am Inn, AT;
Jurgen Mallinger, Senftenbach, AT;
Assignee:
EV GROUP E. THALLNER GMBH, St. Florian am Inn, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 21/67092 (2013.01); H01L 21/67288 (2013.01); H01L 21/6833 (2013.01); H01L 21/6838 (2013.01); H01L 24/83 (2013.01); H01L 2224/7555 (2013.01); H01L 2224/75724 (2013.01); H01L 2224/75725 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/7592 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83908 (2013.01);
Abstract
A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates includes a device in which the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck. A plate is arranged between the second substrate and the second chuck. The second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding.