The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2015
Filed:
Jan. 23, 2012
Klaus Martinschitz, Schärding, AT;
Markus Wimplinger, Ried im Innkreis, AT;
Bernhard Rebhan, Haag a. H., AT;
Klaus Martinschitz, Schärding, AT;
Markus Wimplinger, Ried im Innkreis, AT;
Bernhard Rebhan, Haag a. H., AT;
EV Group E. Thallner GmbH, , AT;
Abstract
A method for bonding a first bond surface of a first solid substrate consisting of a first material to a second bond surface of a second solid substrate consisting of a second material. The method including the steps of: working one of the first and/or second bond surfaces with a cutting tool at a speed vthat is below a critical speed vand at a temperature Tthat exceeds a critical temperature T, down to a surface roughness O that is less than 1 μm; bringing the first solid substrate into contact with the second solid substrate at the bond surfaces, and exposing the solid substrates that are in contact to temperature in order to form a permanent bond that is at least primarily produced by recrystallization at the bond surfaces.