The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Jan. 25, 2011
Thomas Plach, Linz, AT;
Kurt Hingerl, Wolfern, AT;
Markus Wimplinger, Ried im Innkreis, AT;
Christoph Flötgen, Pramerdorf, AT;
Thomas Plach, Linz, AT;
Kurt Hingerl, Wolfern, AT;
Markus Wimplinger, Ried im Innkreis, AT;
Christoph Flötgen, Pramerdorf, AT;
EV Group E. Thallner GmbH, St. Florian am Inn, AT;
Abstract
A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.