The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Feb. 12, 2021
Applicant:

Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;

Inventors:

Kurt Hingerl, Wolfern, AT;

Peter Nikolaus Oberhumer, Gaspoltshofen, AT;

Gunther Hesser, Linz, AT;

Assignee:

EV Group E. Thallner GmbH, St. Florian am Inn, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 21/02 (2006.01); H01L 21/268 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2007 (2013.01); H01L 21/02356 (2013.01); H01L 21/268 (2013.01);
Abstract

A method for bonding a first substrate with a second substrate, with the following sequence: production of a first amorphous layer on the first substrate and/or production of a second amorphous layer on the second substrate, bonding of the first substrate with the second substrate at the amorphous layer or at the amorphous layers to form a substrate stack, irradiation of the amorphous layer or the amorphous layers with radiation in such a way that the amorphous layer or the amorphous layers is/are transformed into a crystalline layer or crystalline layers.


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