The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2020
Filed:
Apr. 08, 2011
Applicants:
Thomas Plach, Linz, AT;
Kurt Hingerl, Wolfern, AT;
Markus Wimplinger, Ried im Innkreis, AT;
Christoph Flötgen, Pramerdorf, AT;
Inventors:
Thomas Plach, Linz, AT;
Kurt Hingerl, Wolfern, AT;
Markus Wimplinger, Ried im Innkreis, AT;
Christoph Flötgen, Pramerdorf, AT;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 23/00 (2006.01); H01L 21/762 (2006.01); H01L 21/3105 (2006.01); H01L 21/18 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 21/187 (2013.01); H01L 21/2007 (2013.01); H01L 21/3105 (2013.01); H01L 21/76251 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 21/0223 (2013.01); H01L 21/02255 (2013.01); H01L 2224/278 (2013.01); H01L 2224/27444 (2013.01); H01L 2224/29188 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/8309 (2013.01); H01L 2224/83896 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/1032 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1082 (2013.01); H01L 2924/10252 (2013.01); H01L 2924/10328 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10331 (2013.01); H01L 2924/10332 (2013.01); H01L 2924/10333 (2013.01); H01L 2924/10334 (2013.01); H01L 2924/10335 (2013.01); H01L 2924/10336 (2013.01); H01L 2924/10346 (2013.01); H01L 2924/10821 (2013.01); H01L 2924/10823 (2013.01); H01L 2924/20106 (2013.01);
Abstract
This invention relates to a method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate with the following steps, especially the following sequence: