Company Filing History:
2 out of 40,739 
1 out of 551 
Years Active: 2003-2021
Title: Kuo-Feng Chen: Innovator in Flexible Electronics
Introduction
Kuo-Feng Chen is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of flexible electronics, holding a total of 3 patents. His innovative approaches have paved the way for advancements in electronic device fabrication.
Latest Patents
One of Kuo-Feng Chen's latest patents is a fabrication method of a flexible electronic device. This method involves placing a flexible substrate directly on a rigid substrate. A portion of the edge of the flexible substrate is heated, resulting in a melted edge. An electronic element is then formed on the flexible substrate within the area surrounded by the melted edge. A separation process follows, allowing the melted edge to be removed and creating a flexible electronic device. Another notable patent is a method and apparatus for pretreating a substrate prior to electroplating. This method includes providing a substrate with a contact pad and an under bump metallurgy, along with a photoresist layer. The photoresist layer has an opening aligned with the contact pad, and the substrate is pretreated with a wetting solution before plating a seed layer over the under bump metallurgy.
Career Highlights
Kuo-Feng Chen has worked with leading companies in the semiconductor and electronics industries, including Taiwan Semiconductor Manufacturing Company Ltd. and E Ink Holdings Inc. His experience in these organizations has contributed to his expertise in flexible electronics and device fabrication.
Collaborations
Throughout his career, Kuo-Feng Chen has collaborated with notable professionals in the field, including Hsiu-Mei Yu and Charles Tseng. These collaborations have further enhanced his innovative work and contributions to the industry.
Conclusion
Kuo-Feng Chen is a distinguished inventor whose work in flexible electronics has led to significant advancements in the field. His patents reflect his commitment to innovation and his impact on the technology landscape.