Taiwan Semiconductor Manufacturing Comp. Ltd.

E Ink Holdings Inc.

Kuo-Feng Chen

Hsiu-Mei Yu

Ta-Yang Lin

Charles Tseng

Ching-Hung Huang

Shu-Han Huang

A fabrication method of a flexible electronic device is provided. A flexible substrate is placed directly on a rigid substrate. A portion of an edge of the flexible substrate is heated, such that the heated portion of the edge of the flexible substrate constitutes a melted edge. An electronic element is formed on the flexible substrate and located in an area region surrounded by the melted edge. A separation process is performed, such that the melted edge is separated from the flexible substrate to form a flexible electronic device.

Fabrication method of flexible electronic device

A method including the step of providing a substrate having a contact pad, and an under bump metallurgy overlying the contact pad, and a photoresist layer overlying the under bump metallurgy, and wherein the photoresist layer has an opening defined therein down to the under bump metallurgy and aligned with the contact pad. Pretreating the substrate with the first wetting solution prior to plating a first seed layer over the under bump metallurgy. Thereafter, plating a first seed layer is plated onto the under bump metallurgy.

Method and apparatus for pretreating a substrate prior to electroplating

Growing community of inventors

Hsinchu, Taiwan

Kuo-Feng Chen