The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
Oct. 20, 2017
Applicant:
E Ink Holdings Inc., Hsinchu, TW;
Inventors:
Assignee:
E Ink Holdings Inc., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01); B32B 38/10 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); B32B 37/10 (2013.01); H05K 3/0052 (2013.01); H05K 3/0055 (2013.01); H05K 3/0097 (2013.01); B32B 27/08 (2013.01); B32B 37/06 (2013.01); B32B 37/182 (2013.01); B32B 38/0004 (2013.01); B32B 38/10 (2013.01); B32B 2457/00 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/065 (2013.01); H05K 2203/107 (2013.01);
Abstract
A fabrication method of a flexible electronic device is provided. A flexible substrate is placed directly on a rigid substrate. A portion of an edge of the flexible substrate is heated, such that the heated portion of the edge of the flexible substrate constitutes a melted edge. An electronic element is formed on the flexible substrate and located in an area region surrounded by the melted edge. A separation process is performed, such that the melted edge is separated from the flexible substrate to form a flexible electronic device.