Kuo-Chun Wu

Title: Innovations of Kuo-Chun Wu in Chemical Mechanical Polishing

Introduction

Kuo-Chun Wu is a prominent inventor based in San Jose, CA, known for his significant contributions to the field of chemical mechanical polishing (CMP). With a total of 8 patents to his name, Wu has developed innovative methods that enhance the efficiency and effectiveness of CMP processes, particularly in semiconductor manufacturing.

Latest Patents

Among his latest patents, Wu has introduced a pad break-in method for CMP tools that utilize ceria-based slurry. This method allows for a new polishing pad to be broken-in and conditioned into a steady operating state while using a silica-based CMP slurry. The conditioned pad is then employed for polishing patterned workpieces, such as semiconductor wafers, with ceria-based CMP slurry. This approach significantly shortens the break-in time and eliminates the first wafer effect typically observed after break-in with ceria-based slurries.

Another notable patent involves a torque-based end-point detection method for CMP tools that use ceria-based slurry. This method employs a torque-based end-point algorithm to determine the optimal time to stop polishing. It is particularly useful for pre-patterned and pre-polished workpieces that have a high friction over-layer and a lower friction underlying layer of sacrificial pads. The algorithm identifies a reliable signature point in the friction versus time waveform, which is used to trigger a specified duration of overpolish, ensuring consistent results in mass production.

Career Highlights

Kuo-Chun Wu is currently associated with Mosel Vitelic Corporation, where he continues to innovate in the field of CMP. His work has been instrumental in advancing the technology used in semiconductor fabrication, making processes more efficient and reliable.

Collaborations

Throughout his career, Wu has collaborated with notable colleagues, including Karen Wong and Wee-chen Richard Gan. These collaborations have contributed to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Kuo-Chun Wu's contributions to chemical mechanical polishing have made a significant impact on the semiconductor manufacturing process. His innovative methods and patents continue to shape the future of CMP technology, demonstrating his expertise and commitment to advancing the field.