The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2005
Filed:
Dec. 03, 2002
Applicant:
Kuo-chun Wu, San Jose, CA (US);
Inventor:
Kuo-Chun Wu, San Jose, CA (US);
Assignee:
Mosel Vitelic, Inc., Hsin Chu, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/302 ;
U.S. Cl.
CPC ...
Abstract
Chemical-mechanical polishing ('CMP') processes performed on bodies (), each having areas (and) of different depression pattern densities, are compared by correlating polishing data accumulated, for one such body, on an area () of one pattern density to polishing data accumulated, for that body, on an area of another pattern density for each of the CMP processes.
Wu, Kuo-Chun. (2005). Comparison of chemical-mechanical polishing processes (U.S. Patent No. 6955987). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6955987
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile