This inventor holds 15 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: International Rectifier Corporation, Broadcom Corporation, Infineon Technologies Americas Corp.. Active years: 2007-2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Irvine, CA (US) (2011 - 2015)
- Santa Monica, CA (US) (2007 - 2016)
Company Filing History:



Years Active: 2007-2016
Areas of Expertise:
Title: Innovations by Inventor Kunzhong Hu in Semiconductor Technology
Introduction
Kunzhong Hu is a prominent inventor based in Santa Monica, California, known for his significant contributions to the field of semiconductor technology. With an impressive portfolio of 15 patents, he has made notable advancements that cater to the evolving demands of the electronics industry. His innovative ideas have led to the development of cutting-edge packages that enhance the performance and efficiency of semiconductor devices.
Latest Patents
Among his latest inventions is a “Semiconductor package with heat spreader,” which features a semiconductor die and a heat spreader that is thermally coupled to the semiconductor. This heat spreader is situated at least partially within the molded housing of the package, optimizing thermal management in semiconductor applications. Another important patent is the “Thermal enhanced high density flip chip package.” This invention utilizes advanced systems and methods that enable flip chip packaging with high-density routing while reducing the thickness and layer count of the flip chip package. By employing a photoresist layer to create ultra-fine traces on a metallic base layer, it combines the benefits of traditional leadframe substrates with laminate substrates, thus supporting high-density routing while minimizing manufacturing costs.
Career Highlights
Kunzhong Hu has held significant positions in notable companies, including International Rectifier Corporation and Broadcom Corporation. His experience in these leading tech firms has played a crucial role in shaping his inventive capabilities and understanding of the semiconductor landscape.
Collaborations
Throughout his career, Hu has collaborated with talented individuals such as Chuan Cheah and Michael A. Briere, enhancing the creativity and innovation of his projects. These collaborations have fostered a dynamic exchange of ideas and expertise in the semiconductor field.
Conclusion
Kunzhong Hu stands out as a visionary inventor whose work in the semiconductor industry continues to push the boundaries of technology. His patents not only demonstrate his technical skills but also pave the way for future innovations in electronics. As the demand for efficient and advanced semiconductor packages grows, Hu's contributions will remain pivotal in the evolution of electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile