The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 11, 2011
Filed:
Mar. 05, 2007
Applicants:
Kunzhong HU, Santa Monica, CA (US);
Chuan Cheah, Redondo Beach, CA (US);
Inventors:
Kunzhong Hu, Santa Monica, CA (US);
Chuan Cheah, Redondo Beach, CA (US);
Assignee:
International Rectifier Corporation, El Segundo, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for fabricating an IC package that includes depositing conductive adhesive bodies on the leads, and then adhering the electrodes of an IC device to the so disposed conductive adhesive bodies.
Quick Actions:
Hu, Kunzhong. (2011). Method for fabricating a semiconductor package (U.S. Patent No. 7867823). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7867823
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile