The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Mar. 07, 2007
Applicants:
Michael A. Briere, Manhattan Beach, CA (US);
Chuan Cheah, Redondo Beach, CA (US);
Kunzhong HU, Santa Monica, CA (US);
Inventors:
Michael A. Briere, Manhattan Beach, CA (US);
Chuan Cheah, Redondo Beach, CA (US);
Kunzhong Hu, Santa Monica, CA (US);
Assignee:
International Rectifier Corporation, El Segundo, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package that includes a semiconductor die and a heat spreader thermally coupled to the semiconductor and disposed at least partially within the molded housing of the package.
Quick Actions:
Briere, Michael. (2013). Semiconductor package (U.S. Patent No. 8564124). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8564124
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile