The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2015
Filed:
Jun. 16, 2011
Chonghua Zhong, Irvine, CA (US);
Kunzhong HU, Irvine, CA (US);
Chonghua Zhong, Irvine, CA (US);
Kunzhong Hu, Irvine, CA (US);
Broadcom Corporation, Irvine, CA (US);
Abstract
Systems and methods according to embodiments of the invention enable flip chip packaging using high density routing while minimizing the thickness and layer count of the flip chip package. By using a photoresist layer to create very fine traces on a metallic base layer, embodiments of the present invention combine advantages of leadframe substrates and laminate substrates by supporting high-density routing while minimizing layer count and manufacturing cost. Additionally, the use of raised metallic pads in a routing layer enables embodiments of the present invention to include highly compact traces that pass over IC die bond pad connection sites without directly coupling to these bond IC die bond pad connection sites. Further, embodiments of the present invention can support multiple thin routing layers without the need for organic (e.g., laminate) material separating these routing layers.