The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7994632 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 09, 2011

Filed:

Jan. 05, 2007
Applicants:

Kunzhong HU, Santa Monica, CA (US);

Chuan Cheah, Redondo Beach, CA (US);

Inventors:

Kunzhong Hu, Santa Monica, CA (US);

Chuan Cheah, Redondo Beach, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A GaN die having a plurality of parallel alternating and closely spaced source and drain strips is contacted by parallel coplanar comb-shaped fingers of source and drain pads. A plurality of enlarged area coplanar spaced gate pads having respective fingers contacting the gate contact of the die. The pads may be elements of a lead frame, or conductive areas on an insulation substrate. Other semiconductor die can be mounted on the pads and connected in predetermined circuit arrangements with the GaN die.


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Hu, Kunzhong. (2011). Interdigitated conductive lead frame or laminate lead frame for gan die (U.S. Patent No. 7994632). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7994632

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