Tokyo, Japan

Kunio Oishi

USPTO Granted Patents = 15 

Average Co-Inventor Count = 3.2

ph-index = 3

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 1988-2024

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15 patents (USPTO):

Title: Kunio Oishi: Innovator in Substrate Processing Technologies

Introduction

Kunio Oishi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of substrate processing, holding a total of 15 patents. His work focuses on improving the efficiency and effectiveness of substrate processing systems.

Latest Patents

Among his latest patents are a substrate processing control system, a substrate processing control method, and a program that enhances local polishing systems. This innovative local polishing system includes a particle estimation unit for estimating the film thickness distribution of a wafer. It also features a local polishing region setting unit that determines a local polishing region based on the film thickness distribution. Additionally, a polishing head selection unit is included to choose a polishing head according to the size of the local polishing region. The system incorporates a model storage that holds a recipe generating model, which defines the relationship between input and output nodes. The polishing recipe generator utilizes attributes of the local polishing region to determine a suitable polishing recipe, which is then transmitted to a local polishing module for execution. Furthermore, he has developed methods for constructing prediction models that forecast the number of plateable substrates and identify components that may cause failures.

Career Highlights

Kunio Oishi has worked with notable companies such as Ebara Corporation and Toshiba Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in substrate processing technologies.

Collaborations

Throughout his career, Oishi has collaborated with talented individuals, including Ryuya Koizumi and Takashi Mitsuya. These partnerships have fostered innovation and the development of cutting-edge technologies in his field.

Conclusion

Kunio Oishi's contributions to substrate processing technologies have made a significant impact in the industry. His innovative patents and collaborations highlight his dedication to advancing this important field.

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