The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2011
Filed:
Oct. 29, 2008
Hidetaka Nakao, Tokyo, JP;
Eisaku Hayashi, Tokyo, JP;
Kunio Oishi, Tokyo, JP;
Isao Hayakawa, Tokyo, JP;
Yoshiaki Miyake, Tokyo, JP;
Yoshikuni Tateyama, Kanagawa, JP;
Takeshi Ashihara, Oita, JP;
Hidetaka Nakao, Tokyo, JP;
Eisaku Hayashi, Tokyo, JP;
Kunio Oishi, Tokyo, JP;
Isao Hayakawa, Tokyo, JP;
Yoshiaki Miyake, Tokyo, JP;
Yoshikuni Tateyama, Kanagawa, JP;
Takeshi Ashihara, Oita, JP;
Ebara Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
An apparatus polishes an object material such as a film on a substrate. This apparatus includes a polishing table for holding a polishing pad having a polishing surface, a motor configured to drive the polishing table, a holding mechanism configured to hold a substrate having an object material to be polished and to press the substrate against the polishing surface, a dresser configured to dress the polishing surface, and a monitoring unit configured to monitor a removal amount of the object material. The monitoring unit is operable to calculate the removal amount of the object material using a model equation containing a variable representing an integrated value of a torque current of the motor when polishing the object material and a variable representing a cumulative operating time of the dresser.