The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2010
Filed:
Aug. 01, 2007
Atsushi Shigeta, Fujisawa, JP;
Gen Toyota, Oita, JP;
Hiroyuki Yano, Yokohama, JP;
Kunio Oishi, Tokyo, JP;
Kenya Ito, Tokyo, JP;
Masayuki Nakanishi, Tokyo, JP;
Kenji Yamaguchi, Tokyo, JP;
Atsushi Shigeta, Fujisawa, JP;
Gen Toyota, Oita, JP;
Hiroyuki Yano, Yokohama, JP;
Kunio Oishi, Tokyo, JP;
Kenya Ito, Tokyo, JP;
Masayuki Nakanishi, Tokyo, JP;
Kenji Yamaguchi, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrateby a motor, polishing a first surface of a peripheral portion of the substrateby pressing a polishing surface of a polishing mechanismagainst the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.