The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 16, 2024
Filed:
Sep. 07, 2017
Ebara Corporation, Tokyo, JP;
Koichi Takeda, Tokyo, JP;
Tsuneo Torikoshi, Tokyo, JP;
Kunio Oishi, Tokyo, JP;
Katsuhide Watanabe, Tokyo, JP;
Hozumi Yasuda, Tokyo, JP;
Yu Ishii, Tokyo, JP;
EBARA CORPORATION, Tokyo, JP;
Abstract
A local polishing system comprises: a particle estimation unit () for estimating the film thickness distribution of a wafer; a local polishing region setting unit () for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit () for selecting a polishing head based on the size of the local polishing region; a model storage () holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator () that puts an attribute of the local polishing region set by the local polishing region setting unit () into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter () for transmitting data of the polishing recipe to a local polishing module () that performs local polishing.