Kuei-Ti Chan

Title: Kuei-Ti Chan: Innovator in Semiconductor Technology

Introduction

Kuei-Ti Chan is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His innovative work has advanced the design and functionality of semiconductor structures and packages.

Latest Patents

One of Kuei-Ti Chan's latest patents is a semiconductor structure that includes a substrate, a first semiconductor die, a second semiconductor die, and a multi-terminal capacitor structure. The substrate features a wiring structure, with both semiconductor dies positioned above it. The multi-terminal capacitor structure is embedded within the substrate and includes terminals that are electrically coupled to the semiconductor dies.

Another notable patent is for a semiconductor package with through-silicon via (TSV) inductor. This package consists of a first die with multiple TSVs and a second die stacked on top. An interposer layer is placed on the lower surface of the first die, housing an inductor that is directly connected to the TSVs.

Career Highlights

Kuei-Ti Chan has worked with leading companies in the semiconductor industry, including MediaTek Corporation and MediaTek Singapore Pte. Ltd. His experience in these organizations has allowed him to develop cutting-edge technologies that enhance semiconductor performance and efficiency.

Collaborations

Throughout his career, Kuei-Ti Chan has collaborated with talented individuals such as Tzu-Hung Lin and Ming-Tzong Yang. These partnerships have fostered innovation and contributed to the advancement of semiconductor technologies.

Conclusion

Kuei-Ti Chan's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced semiconductor solutions.