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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9209148 B1

PDFFull Text
Date of Patent:
Dec. 08, 2015

Filed:

Mar. 20, 2015

Semiconductor package

Applicant:

Mediatek Inc, Hsin-Chu, TW;

Inventors:

Kuei-Ti Chan, Hsinchu, TW;

Tzu-Hung Lin, Zhubei, TW;

Ching-Liou Huang, Qionglin Township, Hsinchu County, TW;

Assignee:

MEDIATEK INC., Hsin-Chu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Bradley K Smith

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01Q 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/528 (2006.01); H01L 23/64 (2006.01); H01L 23/66 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 23/3171 (2013.01); H01L 23/528 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01Q 23/00 (2013.01); H01L 23/525 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/0347 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11912 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/12 (2013.01); H01L 2924/1206 (2013.01);
Abstract

A semiconductor package includes a substrate, a first passivation layer disposed on the substrate, and an under bump metallurgy layer disposed on the first passivation layer. A passive device is disposed on the under bump metallurgy layer, and an additional under bump metallurgy layer is disposed on the first passivation layer, isolated from the under bump metallurgy layer. A conductive pillar is disposed on the additional under bump metallurgy layer, wherein the conductive pillar and the passive device are at the same level.

Find Patent Forward Citations

Chan, Kuei-Ti. (2015). Semiconductor package (U.S. Patent No. 9209148). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9209148

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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