Hsinchu, Taiwan

Kuan-Chung Lu

This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuan-Chung Lu. Retrieved from https://idiyas.com/inventor/kuan-chung-lu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 75.0

Average Co-Inventor Count = 5.9

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2018-2026

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4 patents (USPTO):Explore Patents

Title: Kuan-Chung Lu: Innovator in Semiconductor Technology

Introduction

Kuan-Chung Lu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative manufacturing methods and device structures that enhance the performance and reliability of semiconductor products.

Latest Patents

One of his latest patents is titled "Semiconductor device and manufacturing method thereof." This invention provides a semiconductor device that includes a package structure, a first die, a first containment structure, a pre-fill layer, and a plurality of conductive terminals. The package structure features an attach zone and a keep-out zone surrounding it. The first die is positioned on the package structure within the attach zone and is electrically connected to it. The first containment structure surrounds the first die within the keep-out zone, while the pre-fill layer is strategically placed between the package structure and the first die. The conductive terminals are distributed around the keep-out zone and are also electrically connected to the package structure.

Another notable patent is for a "Package structure and manufacturing method thereof." This invention describes a package structure that incorporates first and second dies, a molding compound, a first redistribution layer, and various through interlayer vias (TIVs). The first die is molded within the compound, while the second die is placed on top of it. The first redistribution layer connects the conductive elements to both dies, ensuring efficient electrical connectivity. The design also includes an electromagnetic interference shielding layer, enhancing the device's performance.

Career Highlights

Kuan-Chung Lu is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading firm in the semiconductor industry. His work at this company has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.

Collaborations

Throughout his career, Kuan-Chung has collaborated with notable colleagues, including Li-Hsien Huang and Der-Chyang Yeh. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Kuan-Chung Lu is a distinguished inventor whose work in semiconductor technology has led to multiple patents and significant advancements in the industry. His innovative approaches to device manufacturing and design continue to influence the field, showcasing his expertise and commitment to technological progress.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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