The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 15, 2020
Filed:
Mar. 26, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Kuan-Chung Lu, Hsinchu, TW;
An-Jhih Su, Taoyuan, TW;
Der-Chyang Yeh, Hsin-Chu, TW;
Li-Hsien Huang, Hsinchu County, TW;
Yueh-Ting Lin, Taipei, TW;
Ming-Shih Yeh, Hsinchu County, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A semiconductor device and the manufacturing method thereof are provided. The semiconductor device includes a package structure, a first die, a first containment structure, a pre-fill layer, and a plurality of conductive terminals. The package structure includes an attach zone, a keep-out zone around the attach zone. The first die is disposed on the package structure in the attach zone and electrically connected to the package structure. The first containment structure is disposed within the keep-out zone of the package structure and surrounds the first die. The pre-fill layer is disposed between the package structure and the first die and between the first containment structure and the first die, where the pre-fill layer is constrained within the first containment structure. The conductive terminals are disposed on the package structure, distributed around the keep-out zone of the package structure, and electrically connected to the package structure.