Koji Hashizume is a prominent inventor based in Kasugai, Japan. He has made significant contributions to the field of substrate fabrication, holding a total of 14 patents. His work focuses on improving the manufacturing processes of bonded substrates, which are essential in various technological applications.

Latest Patents

Hashizume's latest patents include an "Apparatus and method for fabricating bonded substrate" and an "Apparatus for manufacturing bonded substrate." The first patent describes a bonded-substrate fabricating apparatus designed to reduce defective bonded substrates. This innovative device utilizes a transfer robot that sucks the outer edge area of the substrate's bottom surface and spouts gas to carry the substrate into a vacuum process chamber while maintaining its horizontal position. The second patent presents an apparatus that suppresses defects in bonded substrates by employing upper and lower chuck units that attract substrates through vacuum and electrostatic forces, ensuring accurate alignment during the bonding process.

Career Highlights

Koji Hashizume is currently employed at Fujitsu Corporation, where he continues to develop advanced technologies in substrate manufacturing. His expertise and innovative mindset have positioned him as a key figure in his field.

Collaborations

Throughout his career, Hashizume has collaborated with notable colleagues, including Yoshimasa Miyajima and Norihiko Hatano. These partnerships have contributed to the advancement of their shared goals in substrate technology.

Conclusion

Koji Hashizume's contributions to the field of substrate fabrication through his patents and work at Fujitsu Corporation highlight his role as an influential inventor. His innovative approaches continue to shape the future of manufacturing processes.

Profile summary based on public USPTO records.

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