Fujitsu Corporation

Koji Hashizume

Tetsuji Kadowaki

Yoshimasa Miyajima

Norihiko Hatano

Tsukasa Adachi

Takanori Muramoto

Yosimasa Miyajima

Takuya Ohno

Takao Kojima

Masahiro Nishi

Ryoji Matsuyama

Toshikatsu Shimura

A bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

Apparatus and method for fabricating bonded substrate

The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.

Apparatus for manufacturing bonded substrate

The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.

A method for bonding a first substrate with a second substrate in a treatment chamber, wherein the treatment chamber accommodates a first holding unit that attracts the first substrate and a second holding unit that attracts the second substrate. The method includes the steps of transporting the first and second substrates as a pair to the treatment chamber; vacuum attracting at least one of the first and second substrates to the associated holding unit by applying an attraction pressure to at least one of the first and second substrates; depressurizing the treatment chamber to a predetermined level; attracting at least one of the substrates by at least one of another holding devices provided in at least one of the holding units after the pressure in the treatment chamber reaches the predetermined vacuum level, and after the pressure in the treatment chamber reaches the predetermined vacuum level, controlling (with a controller) the attraction pressure applied to at least one of the first and second substrates to be substantially equal to the predetermined vacuum level of the treatment chamber.

Method for manufacturing bonded substrate

Disclosed is a bonded-substrate fabricating apparatus capable of reducing defective bonded substrates fabricated. A transfer robot sucks the outer edge area of the bottom surface of a substrate and spouts gas toward the bottom surface of the substrate to carry the substrate into a vacuum process chamber of a press machine while keeping the substrate horizontally. A press plate holds the substrate, which is held by the transfer robot, by suction.

A work conveying and transferring apparatus has a trolley having a casing defining a hermetically sealed space, and a support portion provided on the trolley for placing at least one container containing a cassette carrying works. A container opening device is provided on the trolley to open the container placed on the support portion, and a cassette transferring device is provided for transferring the cassette from the trolley to a treating apparatus, with the container placed on the support portion opened. The support portion is provided in the sealed space, and works can be double sealed by the sealed space and the container.

Growing community of inventors

Kasugai, Japan

Koji Hashizume