The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2006
Filed:
Nov. 30, 2001
Koji Hashizume, Kasugai, JP;
Yoshimasa Miyajima, Kasugai, JP;
Norihiko Hatano, Kasugai, JP;
Tetsuji Kadowaki, Kasugai, JP;
Koji Hashizume, Kasugai, JP;
Yoshimasa Miyajima, Kasugai, JP;
Norihiko Hatano, Kasugai, JP;
Tetsuji Kadowaki, Kasugai, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.